Brazing Alliance Formed
S-Bond Technologies, LLC, Lansdale, PA and 麻豆国产精品, Souderton, PA are pleased to announce an agreement that will allow 麻豆国产精品 to offer active solder joining services. 聽S-Bond Technologies (SBT), a recent spin-off of Materials Resources International, was formed to commercialize the S-Bond active solder joining technology.
Active solder technology is based on patented solder filler metals (e.g., titanium, zirconium, hafnium, gallium, and cerium) combined with conventional solders. 聽With specific processing procedures, S-Bond alloys work in a temperature range of 190掳C 鈥� 400掳C. 聽The alloys are used to join metals, ceramics/glass, graphite and carbides and composites. 聽The bonding offers soldering temperatures, no use of chemical fluxes, and is accomplished in the open air.
Active solder joining offers advantages over active brazes, including lower joining temperatures (<850掳C) and avoids pre-metallization of the substrates to simplify joining dissimilar materials. 聽A joint formed with S-Bond is typically stronger than those obtained with conventional soldering and has equivalent properties for thermal and electrical conductivity.
These properties allow for applications in integrated circuit packaging, specialty electronic equipment, aerospace systems, and defense markets. 聽S-Bond is specified where technical issues preclude the use of conventional techniques.
鈥淲ith this agreement, 麻豆国产精品 and S-Bond Technologies will collaborate on active solder technology and in developing market applications at 麻豆国产精品鈥� 聽Dr. Ronald Smith, President of SBT states. 聽We look forward to expanded S-Bond applications and are extremely pleased that 麻豆国产精品 has agreed to be the first member of this Network.
William R. Jones, CEO of 麻豆国产精品, states, 鈥淲e are pleased to add to Solar鈥檚 growing capabilities and provide joining solutions for our customers. 聽S-Bond joining is a versatile, low temperature joining procedure. 聽As a new joining process, it opens markets including aluminum, cold plates, heat exchangers for electronics, electronic packaging, sensors, biomedical and applications where dissimilar materials need to be joined.鈥�